Data Center Thermal Control
Data Center Liquid Cooling Components
Jadecooling Tech provides Data Center Liquid Cooling Components for high-density servers, AI computing platforms, HPC systems, cloud infrastructure and other data-center applications where conventional air cooling is no longer sufficient to manage rising heat loads.
Our liquid cooling product range covers the key components required to move coolant safely and efficiently from the facility or rack distribution level to the heat source. From liquid cooling cold plates and manifolds to quick connectors, pipeline networks and integrated CPU liquid cooling modules, Jadecooling Tech supports OEM and ODM customers developing direct-to-chip liquid cooling architectures.
Our main data center liquid cooling products include:
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Liquid Cooling Quick Connector – Quick-disconnect components for reliable coolant connection and maintenance
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Liquid Cooling Pipeline Network – Customized coolant distribution pipelines for rack and server thermal systems
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Liquid Cooling Cold Plate – Direct-to-chip cold plates for CPUs, GPUs and other high-heat-flux electronic components
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Manifold – Coolant distribution manifolds for multiple liquid cooling branches
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Dual-CPU Integrated Liquid Cooling Module – Integrated liquid cooling assemblies for dual-processor server platforms
Jadecooling Tech can support projects from component design and prototype evaluation through assembly and volume manufacturing.
Our Data Center Liquid Cooling Product Range
| Liquid Cooling Component | Main Function | Typical Application | Main Design Focus |
|---|---|---|---|
| Liquid Cooling Cold Plate | Transfers heat directly from CPU, GPU or accelerator into coolant | AI servers, HPC, high-power CPUs and GPUs | Thermal resistance, channel structure, pressure drop |
| Liquid Cooling Quick Connector | Enables rapid connection and disconnection of coolant lines | Server and rack maintenance | Leak prevention, flow rate, pressure resistance |
| Liquid Cooling Pipeline Network | Carries coolant between cold plates, manifolds and distribution points | Servers and rack systems | Routing, diameter, flow balance, space utilization |
| Manifold | Distributes coolant across multiple branches | Multi-server and multi-component loops | Flow balancing, port layout, pressure loss |
| Dual-CPU Integrated Liquid Cooling Module | Integrates cooling for two processors into one assembly | Dual-socket servers | CPU spacing, flow path, mechanical integration |
Key Parameters in Data Center Liquid Cooling Design
A successful liquid cooling component must be developed around several interacting parameters.
Thermal Load
The heat generated by the CPU, GPU or accelerator determines how much thermal energy must be transferred into the coolant.
Coolant Flow Rate
Higher flow can improve heat removal, but it may also increase pumping requirements and system pressure.
Pressure Drop
Cold plates, connectors, tubing and manifolds all contribute to total hydraulic resistance.
Coolant Temperature
The inlet temperature affects the temperature difference available for heat transfer.
Material Compatibility
Copper, aluminum, stainless steel, sealing materials and coolant chemistry should be evaluated together to reduce compatibility and corrosion risks.
Leak Prevention
Liquid cooling components must maintain reliable sealing during operation, assembly, maintenance and transportation.
Mechanical Envelope
The cooling hardware must fit around sockets, DIMMs, GPUs, VRMs, cables and chassis structures.
Serviceability
Data-center hardware must often be replaced or serviced quickly, making connector layout and component accessibility important.
OEM & ODM Liquid Cooling Manufacturing
Jadecooling Tech works with customers developing data-center and computing hardware where standard liquid cooling components cannot fully meet the mechanical or thermal requirements.
Typical customers include:
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Server manufacturers
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AI server developers
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GPU computing platform manufacturers
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Data-center equipment suppliers
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Rack solution providers
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HPC hardware companies
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Cloud infrastructure equipment manufacturers
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Telecom equipment manufacturers
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Electronics OEMs and ODMs
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Thermal solution integrators
For these buyers, direct cooperation with a component manufacturer provides greater flexibility in adapting the cooling hardware to the platform.
Develop Your Data Center Liquid Cooling Components With Jadecooling Tech
As CPU and GPU power density continues to rise, liquid cooling hardware must be designed as part of the complete server and rack architecture.
The performance of a direct-to-chip cooling system depends not only on the cold plate, but also on how coolant is connected, distributed and routed throughout the system.
Jadecooling Tech provides Data Center Liquid Cooling Components covering the complete component chain from Liquid Cooling Cold Plates and Quick Connectors to Pipeline Networks, Manifolds and integrated CPU cooling modules.
Send us your CPU/GPU specifications, server layout, thermal load, coolant flow requirements and mechanical drawings. Jadecooling Tech can evaluate suitable liquid cooling components for your data-center hardware project.
