Liquid Cooling Cold Plate
The liquid cooling cold plate is the core heat exchange component of data center liquid cooling thermal control systems. It fits closely on the heating surface of high-power server chips, completing efficient heat exchange through internal cooling liquid circulation and rapidly removing concentrated heat generated by high-load operation of computing equipment.
CORE FEATURES
Flat laminar structure achieves tight fitting with heating surfaces.
Internal micro-channel structure improves overall heat exchange efficiency.
High thermal conductivity material accelerates rapid heat conduction.
Integrated sealing structure eliminates liquid leakage risks.
TECHNICAL SPECIFICATIONS
| Parameter | Specification |
| Dimension | Standard / customized fitting size |
| Weight | Lightweight flat structural design |
| Material | High thermal conductivity aluminum / copper alloy optional |
| Heat Exchange Level | Industrial standard liquid cooling efficiency |
| Interface | Standard pipeline connection port |
COMPATIBILITY
Compatible with mainstream high-power server chips and standard data center liquid cooling circulating systems.
APPLICATION SCENARIOS
Data center high-performance servers, cloud computing high-load equipment, industrial high-power computing hardware.
CUSTOMIZATION CAPACITY
Supports full customization of fitting dimensions.
Supports optimization of internal micro-channel structure.
Supports personalized adjustment of interface position and specification.
