Dual-CPU Integrated Liquid Cooling Module
The dual-CPU integrated liquid cooling module is an integrated high-efficiency thermal control component for high-density dual-processor server equipment. It integrates dual-chip heat exchange structure and liquid circulation interfaces, realizing synchronous liquid cooling heat dissipation for two CPUs simultaneously and solving concentrated heat generation problems of high-power dual-processor server equipment in data center scenarios.
CORE FEATURES
Dual-CPU integrated design saves internal server assembly space.
Synchronous heat exchange structure ensures balanced temperature of dual chips.
Integrated interface layout simplifies overall liquid cooling system assembly.
High-efficiency circulation structure adapts to ultra-high power heat generation.
TECHNICAL SPECIFICATIONS
| Parameter | Specification |
| Dimension | Customized dual-processor fitting size |
| Weight | Integrated modular structural weight |
| Material | High thermal conductivity industrial alloy |
| Applicable TDP | Combined power range of dual high-power CPUs |
| Cooling Mode | Closed-loop liquid circulating heat exchange |
COMPATIBILITY
Compatible with mainstream dual-CPU high-density server motherboards and standard data center liquid cooling systems.
APPLICATION SCENARIOS
Large data center high-performance computing servers, dual-processor industrial high-load equipment, cloud computing core server devices.
CUSTOMIZATION CAPACITY
Supports customization of dual-chip spacing structure.
Supports upgrade of overall heat exchange efficiency.
Supports integrated matching customization of interfaces and pipelines.
