Data Center Thermal Management Solution
Industry Pain Points
High-density server clusters in data centers produce extremely high heat flow density during ultra-high load operation. Traditional air cooling schemes have limited heat dissipation efficiency, which cannot meet the heat dissipation requirements of large-scale long-term computing operation. Complex pipeline circulation layout easily causes unbalanced branch flow and pressure difference, affecting the overall stability of the thermal control system.
Liquid cooling systems face hidden risks such as poor interface sealing, pipeline aging and unbalanced liquid distribution in long-term operation. The matching degree of conventional cold plate structure and high-power chip heat source is insufficient, resulting in low overall heat exchange efficiency. Modular equipment maintenance and disassembly lack convenient structural support, increasing daily operation and maintenance costs.
Technical Solution
We provide integrated liquid cooling thermal management solutions for large-scale data center scenarios. The solution takes liquid circulation heat exchange as the core, optimizes modular pipeline network layout and shunt confluence structure, and realizes balanced liquid supply and efficient heat exchange for server clusters.
By adopting high-precision sealing connection structure and customized cold plate fitting design, it improves the fitting degree between heat exchange components and high-power heat sources. The modular integrated layout simplifies system assembly and maintenance procedures, adapts to large-scale cluster operation scenarios, and realizes stable and low-energy consumption thermal control operation of data center equipment.
Product Portfolio
The supporting product system covers full-set liquid cooling thermal control components for data centers, including liquid cooling quick connectors, circulating pipeline networks, liquid cooling cold plates, manifold shunt components and dual-CPU integrated liquid cooling modules. The complete product combination realizes integrated matching of liquid transmission, shunt control, heat exchange and assembly connection, covering all links of data center liquid cooling system.
Success Cases
The solution has been deployed in multiple modular data center liquid cooling projects. It provides stable circulating heat dissipation support for high-performance computing server clusters and long-running cloud computing equipment. The overall system maintains balanced operating pressure and efficient heat exchange efficiency in long-term cluster operation, meeting the continuous and stable operation standards of large data centers.
Technical Advantages
The liquid cooling integrated scheme has higher heat exchange efficiency than traditional air cooling systems, adapting to ultra-high heat flow density operation scenarios of data centers. The modular pipeline and shunt structure realize balanced liquid distribution of multiple branches and eliminate system pressure difference.
High-precision sealing components effectively avoid liquid leakage and improve long-term operational stability. Customized cold plate and integrated module design improve the fitting accuracy of heat sources and optimize overall thermal resistance. The standardized modular structure reduces later operation and maintenance difficulty.
For further parameter verification, scheme docking and batch project cooperation of data center thermal management solutions, please contact our official technical team.
