Multi-CPU Integrated Server Heat Sink
The multi-CPU integrated heat sink is an integral thermal control component designed for high-density multi-processor server equipment. Aiming at concentrated heat generation in closed server cabinet space, the product adopts integrated heat conduction layout to realize synchronous heat dissipation and balanced temperature control for multiple CPU heat sources, adapting to 24-hour continuous high-load operation of industrial servers.
CORE FEATURES
Integrated structural design realizes simultaneous heat dissipation for multiple processors.
Overall balanced thermal layout eliminates local hot spot accumulation.
High structural rigidity resists long-term equipment operating vibration.
Industrial-grade materials ensure stable performance under continuous operation.
TECHNICAL SPECIFICATIONS
| Parameter | Specification |
| Dimension | Customized for server integrated assembly space |
| Weight | Industrial standard structural weight |
| Material | High thermal conductivity industrial alloy |
| Supported TDP | High-power multi-processor combined power range |
| Heat Dissipation Mode | High-efficiency passive heat conduction |
| Structural Feature | Multi-core integrated positioning design |
COMPATIBILITY
Compatible with mainstream high-density multi-CPU server motherboards and standard industrial server cabinets.
APPLICATION SCENARIOS
Enterprise high-performance computing servers, industrial data processing servers, multi-processor parallel operation equipment.
CUSTOMIZATION CAPACITY
Supports customization of CPU spacing layout.
Supports overall structural size adjustment based on cabinet space.
Supports optimization of material thermal conductivity parameters.
