Aug.17,2026

CPU Heat Sink: How It Works, Types, Materials, and Selection Guide

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Jun.29,2026

Core Structural Differences Between Embedded Heat Pipe Assembly & Microchannel Liquid Cold Plate in Passive-Active Hybrid Thermal Dissipation

As electronic hardware continues evolving toward compact outline and rising power density, hybrid passive-active cooling configurations gradually replace single air-cooled radiators across industrial control...

Jun.29,2026

Gradual Localization Upgrade of Mid-tier Thermal Component Supply Chain in Southeast Asian Industrial Electronic Manufacturing Base

Against the backdrop of global industrial electronic production capacity layout adjustment, mid-stream thermal management supporting component supply chain including precision stamping heat sink...

Jun.29,2026

Two-Year R&D Iteration Story of Ultra-Thin Composite Heat Pipe Module Tailored for Compact Industrial Power Equipment

Launched in early 2024, our internal independent R&D project of ultra-thin composite heat pipe module targets compact industrial power equipment whose internal installation space is compressed over 30% compared with traditional cabinet, aiming to develop heat pipe product with wall thickness below 0.32mm and stable working performance under frequent cold-hot alternation environment...